DELTA-FLY-PHARMA
7.2.2024 12:01:32 CET | Business Wire | Press release
Following the previous information on Jan. 5th. in 2024, we are excited to share our latest development status.
A Phase I clinical dose-finding study of DFP-14927 in patients with solid tumors has been completed at MD Anderson Cancer Center and the University of California, Los Angeles in the United States. Subsequently, the concentration of DFP-10917, the active component of DFP-14927, delivering into cancer tissue in patients treated with DFP-14927 is being measured to confirm PK/PD relationship for the clinical efficacy of DFP-14927.
On 6th Feb. 2024, we are pleased to announce that we have submitted an abstract to the 2024 ASCO annual meeting to be held from May 31st this year in Chicago.
DFP-14927 is an amide bond of DFP-10917 to a carboxylic acid at the end of polyethylene glycol (PEG) with a molecular weight of 40,000, and it is extremely stable in human blood after intravenous administration, allowing for weekly treatment regimen. DFP-14927 is a drug delivery system (DDS) with a mechanism that allows selective release of DFP-10917 into cancer tissues by amidolysis of proteases that are highly expressed in them.
Compared to high molecular weight antibody-drug conjugates (ADCs), medium-sized PEG covalent conjugates are known to have retention in blood vessels around cancer and cancer cell membranes and higher permeability into tumors, and therefore, the concentration of DFP-10917 in cancer tissue can be measured by conventional analysis without the use of radioisotope technology.
Soon after the expected effective concentration of DFP-10917 in cancer tissue is confirmed in the study, we plan to conduct an expanded Phase I study, equivalent to a Phase II clinical trial, in patients with colorectal cancer who have failed existing approved drugs.
The composition of matter patent for DFP-14927 has been granted in the United States, Europe, Asian countries and others, which will enable global marketing of DFP-14927.
In collaboration with leading oncology hospitals in the U.S., we are considering the development of DFP-14927 in haematological cancers such as acute myeloid leukemia (AML) and myelodysplastic syndrome (MDS) in addition to solid tumors.
For our future global development and marketing strategy, we are considering collaboration with a major global pharmaceutical company that has strength and expertise in the oncology.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240207063856/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Growing with Purpose, Delivering with Impact: ProAmpac Releases 2026 Sustainability Impact Report4.8.2026 17:13:00 CEST | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the release of its 2026 Sustainability Impact Report, centered around the theme Growing with Purpose, Delivering with Impact, the report highlights the company's advancements in sustainable innovation, environmental stewardship, employee safety, and responsible business practices while expanding its global footprint. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804969765/en/ ProAmpac's 2026 Impact Report is here Reflecting another year of meaningful achievements, the report demonstrates how ProAmpac is embedding sustainability throughout its business, from advancing innovative packaging solutions and reducing environmental impacts to strengthening workplace safety and supporting the communities where employees live and work. Notable achievements highlighted in the 2026 Sustainability Impact Report include:Continued Global Growth: Expanded Pr
New Esri Press Book Empowers Users to Unlock the Potential of AI with the Power of Geography4.8.2026 16:35:00 CEST | Press release
Exploring GeoAI: Tools and Workflows Offers Cutting-Edge Geospatial AI Models and Step-By-Step Tutorials Using ArcGIS Esri has released Exploring GeoAI: Tools and Workflows, a practical guide for applying geospatial AI using ArcGIS. Designed for GIS professionals, analysts, and data scientists, the workbook supports real-world spatial analysis through hands-on GeoAI workflows. The book addresses the growing importance of GeoAI by guiding readers through data preparation, model training, evaluation, and deployment. Step-by-step tutorials use real-world datasets to demonstrate deep learning, object detection, lidar classification, transfer learning, and predictive spatial analysis in ArcGIS. Esri has released Exploring GeoAI: Tools and Workflows, a practical guide to applying geospatial artificial intelligence (GeoAI) using ArcGIS. Designed for GIS professionals, analysts, and data scientists, this hands-on workbook provides the knowledge and tools needed to integrate advanced AI workflo
Rehlko Defines What It Takes to Build AI-Ready Power Infrastructure as Data Center Energy Demands Evolve4.8.2026 15:15:00 CEST | Press release
New eBook highlights how increasingly dynamic AI workloads are reshaping critical power requirements and explores strategies for building resilient, scalable energy infrastructure Rehlko, a global industrial energy resilience platform providing custom-engineered, integrated power solutions for mission-critical infrastructure worldwide, today released new insights on the power infrastructure requirements emerging from the rapid growth of large language models and artificial intelligence. In its latest eBook, AI Readiness Starts with Power: Designing for Real-World Load Conditions, Rehlko examines how increasingly dynamic AI workloads are reshaping expectations for data center power systems and highlights key infrastructure considerations for operators seeking to scale AI capacity reliably and efficiently. As the eBook outlines, AI readiness is increasingly defined not by installed capacity, but by how systems perform under highly variable real-world load conditions. The AI Power Challen
HappyRobot Raises $150 Million Series C to Build Enterprise Superintelligence4.8.2026 14:30:00 CEST | Press release
New funding led by Prysm Capital and co-led by Eurazeo will accelerate global growth as HappyRobot expands its engineering, deployment and go-to-market teams HappyRobot, the company putting AI agents to work across complex enterprise operations, today announced it has raised $150 million in Series C funding led by Prysm Capital and co-led by Eurazeo. Existing investors a16z, Base10, Y Combinator are doubling down with participation from strategics like Koch Disruptive Technologies (KDT), Orange, and T.Capital (Deutsche Telekom), Bankinter, Endeavor Catalyst, Kfund and Wave-X. The round values the company at $1.2 billion post-money, bringing total funding to around $200 million and marking a new stage of growth as enterprises deploy AI agents across mission-critical work. HappyRobot works with more than 150+ enterprise customers, including DHL, Kuehne + Nagel, Naturgy, Repsol, and Uber, and has grown 5x since raising its Series B late last year. After first proving its platform in logis
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND4.8.2026 14:30:00 CEST | Press release
10th-generation QLC 3D flash memory represents a major leap forward for AI storage architectures, cloud platforms, and data‑intensive innovations Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804147821/en/ Leveraging the companies’ revolutionary CMOS directly Bonded to Array (CBA) technology2 which fabricates CMOS logic and the memory array on separate wafers before bonding them together with high-precision wafer-to-wafer alignment, the new generation improves read and write bandwidth c
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
