NC-LENOVO
18.1.2024 15:01:36 CET | Business Wire | Press release
Today, Lenovo announced it has joined the ServiceNow Consulting and Implementation Partner Program to help organizations take advantage of innovative workflows developed by Lenovo using ServiceNow platform capabilities.
As a ServiceNow Consulting and Implementation partner, Lenovo will utilize its extensive industry expertise, services track record, and large-scale implementation knowledge to help customers accelerate their digital transformation through the Now Platform. Lenovo will initially offer a gateway for transformative Digital Workplace capabilities to customers in Australia and Hong Kong, with further territories across the globe to follow.
The revamped ServiceNow Partner Program recognizes partners for their varied expertise and experience to drive opportunities, reach new markets, and help joint customers in their digital transformation efforts.
Lenovo is expanding its Digital Workplace Solutions capabilities with the Consulting and Implementation Partner Program to supply services through the Now platform, such as Order Management, Enterprise Asset Management, Service Bridge, Service Portfolio Management, Technology Provider Service Management, Security Operations, IT Service Management, IT Operations Management and Generative AI solutions which can be bundled with Lenovo Care of One platform capabilities.
Through the program and Lenovo’s implementation of the Now Platform, customers will benefit from the latest Lenovo Digital Workplace Solutions, meaning they will be able to more effectively manage the client, vendor, and employee experience, integrate new services into existing systems, improve security and data protection controls and leverage AI capabilities.
“This joint go-to-market approach with ServiceNow means we’re providing customers with the very latest IT solutions to help them transform and stay competitive in a digital world. We’re supporting customers across all industries both as a ServiceNow service provider as well as offering consulting and solutions integration capabilities across Lenovo’s service management portfolio. It means we can harness our collective expertise to elevate the customer experience, solve customers’ most complex business challenges and accelerate successful digital transformation outcomes,” said Linda Yao, Chief Operating Officer and Head of Strategy, Lenovo Solutions & Services Group.
“As a customer and now a valued ServiceNow partner, Lenovo will drive continuous business improvement for our customers and leverage the Now Platform to help accelerate time to revenue,” said Marion Ryan, VP, Alliances and Channel Ecosystem APJ at ServiceNow. “This partnership will enable faster collaboration with customers, measurable value and high levels of client satisfaction.”
Consulting and Implementation partners leverage industry or domain expertise to guide customers on how to introduce and utilize ServiceNow solutions to help their businesses grow and succeed. Partners use ServiceNow resources to influence deals, track technology deployments, and drive adoption of new solutions.
Visit www.lenovo.com/digital-workplace-solutions to learn more about Lenovo’s Digital Workplace Solutions.
About Lenovo
Lenovo is a US$62 billion revenue global technology powerhouse, ranked #217 in the Fortune Global 500, employing 77,000 people around the world, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver Smarter Technology for All, Lenovo has built on its success as the world’s largest PC company by further expanding into growth areas that fuel the advancement of ‘New IT’ technologies (client, edge, cloud, network, and intelligence) including server, storage, mobile, software, solutions, and services. This transformation together with Lenovo’s world-changing innovation is building a more inclusive, trustworthy, and smarter future for everyone, everywhere. Lenovo is listed on the Hong Kong stock exchange under Lenovo Group Limited (HKSE: 992)(ADR: LNVGY). To find out more, visit https://www.lenovo.com, and read about the latest news via our StoryHub.
LENOVO is a trademark of Lenovo. All other trademarks are the property of their respective owners. ©2024 Lenovo.
ServiceNow, the ServiceNow logo, Now, Now Platform, and other ServiceNow marks are trademarks and/or registered trademarks of ServiceNow, Inc. in the United States and/or other countries.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240118998294/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom