Business Wire

CA-QUALCOMM

17.1.2024 15:01:33 CET | Business Wire | Press release

Share
Qualcomm Schedules First Quarter Fiscal 2024 Earnings Release and Conference Call

Qualcomm Incorporated (NASDAQ: QCOM) today announced that it will publish the Company’s financial results for its first quarter fiscal 2024 on Wednesday, January 31, 2024, after the close of the market on the Company’s Investor Relations website, at https://investor.qualcomm.com/financial-information. The earnings release will also be furnished to the Securities and Exchange Commission (SEC) on a Form 8-K, which will be available on the SEC website at http://www.sec.gov.

Qualcomm will host a conference call to discuss its first quarter fiscal 2024 results which will be broadcast live on January 31, 2024, beginning at 1:45 p.m. Pacific Time (PT) at https://investor.qualcomm.com/news-events/events. An audio replay will be available at https://investor.qualcomm.com/news-events/events and via telephone following the live call for 30 days thereafter. To listen to the replay via telephone, U.S. callers may dial (877) 660-6853 and international callers may dial (201) 612-7415. Callers should use reservation number 13743224.

About Qualcomm

Qualcomm is enabling a world where everyone and everything can be intelligently connected. Our one technology roadmap allows us to efficiently scale the technologies that launched the mobile revolution – including advanced connectivity, high-performance, low-power compute, on-device intelligence and more – to the next generation of connected smart devices across industries. Innovations from Qualcomm and our family of Snapdragon platforms will help enable cloud-edge convergence, transform industries, accelerate the digital economy, and revolutionize how we experience the world, for the greater good.

Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering and research and development functions and substantially all of our products and services businesses, including our QCT semiconductor business. Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patented technologies are licensed by Qualcomm Incorporated. For more information, visit www.qualcomm.com.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240117696431/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Teva and Polpharma Biologics Announce Global Licensing Agreement for a Biosimilar Candidate to Ocrevus® (ocrelizumab) for Multiple Sclerosis9.7.2026 14:45:00 CEST | Press release

Teva secures exclusive global rights to commercialize Polpharma Biologics’ biosimilar candidate to Ocrevus® (ocrelizumab), including both intravenous and subcutaneous formulations.Agreement advances Teva’s Pivot to Growth strategy by expanding its biosimilars pipeline through strategic collaborations.Agreement reflects both companies’ commitment to broadening access to biologic medicines. Teva Pharmaceuticals International GmbH, a subsidiary of Teva Pharmaceutical Industries Ltd (NYSE: and TASE: TEVA) and Polpharma Biologics International AG today announced a global licensing agreement granting Teva exclusive rights to commercialize both formulations of Polpharma Biologics’ proposed biosimilar to Ocrevus®1 (ocrelizumab), upon regulatory approval. This strategic agreement is expected to combine Polpharma Biologics’ proven biosimilar development expertise with Teva’s commercial footprint and capabilities. This press release features multimedia. View the full release here: https://www.bus

Elliptic Announces Circle’s Participation in Agentic Design Partner Program9.7.2026 14:15:00 CEST | Press release

Following investment from Circle Ventures, the corporate venture arm of Circle Elliptic, the global leader in digital asset intelligence, today announced that an affiliate of Circle Internet Group, Inc. (‘Circle’) (NYSE:CRCL) has joined its Agentic Design Partner Program, bringing together infrastructure providers, compliance teams, and technology leaders to help shape compliance solutions for autonomous, AI-driven financial activity. This momentum follows an investment from Circle Ventures, the corporate venture arm of Circle, and builds on a longstanding collaboration between the companies. Circle has been an Elliptic customer for multiple years and has expanded its use of Elliptic’s compliance capabilities across a range of digital asset initiatives. As stablecoins, tokenized assets, and AI-powered applications become increasingly integrated into financial services, new compliance challenges are emerging. Elliptic’s agentic compliance layer addresses these challenges by combining un

Russell Investments Announces New Long-Term Owners9.7.2026 14:00:00 CEST | Press release

An investor consortium led by B Capital and including CalPERS will provide long-term capital to expandRussell Investments’ client capabilities and accelerate innovation Russell Investments, the global investment solutions provider, today announced that an investor consortium (the “Investor Consortium”) led by B Capital, a global multi-stage investment firm, and including California Public Employees' Retirement System ("CalPERS"), has agreed to acquire the firm from TA Associates (“TA”) and Reverence Capital Partners (“RCP”). The transaction comes as Russell Investments marks over $416 billion in global assets under management (AUM) and has experienced more than 15% organic growth over the past two years. Russell Investments has been a trusted, independent partner to its clients for over 90 years. Its open-architecture model delivers portfolio solutions that source from the full landscape of the asset management industry across public and private markets. With a shared vision for the co

Esri and Global Partners Release HydroSHEDS v2 for the Americas9.7.2026 14:00:00 CEST | Press release

Next-Generation Hydrographic Framework Delivers Unprecedented Detail for Watershed and River Network Analysis Esri and its global partners have released HydroSHEDS v2, providing high-resolution hydrographic data for North, Central, and South America. Developed with World Wildlife Fund in the US, McGill University and Confluvio Consulting in Canada, and the German Aerospace Center (DLR), the initiative reflects global collaboration in hydrologic science and geospatial technology. HydroSHEDS v2 leverages TanDEM-X elevation data and Arc Hydro workflows to deliver more accurate drainage networks, watershed boundaries, and hydrologic connectivity. The datasets support applications such as flood risk assessments, climate resilience studies, systematic conservation planning, water resource management, and environmental decision-making. HydroSHEDS v2 datasets are available through ArcGIS Living Atlas, with additional global releases planned as part of a phased rollout. Esri has made HydroSHEDS

NIPPON KINZOKU Accelerates Global Sales of Ultra-Thin Electrical Steel Strips "GT Series" and "ST Series" as "Fine Eco Metal" Environmentally Friendly Products9.7.2026 10:01:00 CEST | Press release

- Delivering the ultimate balance of “Ultra-Thinness” and “Low Core Loss” to drastically reduce high-frequency energy loss - NIPPON KINZOKU CO., LTD. (Headquarters: Minato-ku, Tokyo; President: Yasushi Shimokawa; TOKYO: 5491) and its subsidiary, NIKKIN DENJI KOGYO CO., LTD. (Headquarters: Kawaguchi, Saitama; President: Akira Nishimura), are launching a strategic sales initiative for their ultra-thin Grain-Oriented (GT Series) and Non-Oriented (ST Series) electrical steel strips under the brand name "Fine Eco Metal". This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260709899733/en/ By reducing the thickness of the electrical steel strip, eddy current loss (core loss) can be significantly lowered. Eddy currents are electrical currents generated within the electrical steel strip by alternating magnetic fields; they are a primary factor that increases core loss. "Fine Eco Metal" is a brand name for our proprietary "Eco-Product" se

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye