PHENOM
22.5.2023 11:01:29 CEST | Business Wire | Press release
Phenom has been named a Strategic Leader in the 2023 Fosway 9-GridTM for Talent Acquisition for the third consecutive year, proving its ability to deliver higher levels of innovation, customer impact and advocacy compared to alternatives in the market. Fosway identifies Strategic Leaders as companies that provide a rich suite of capability across a broad scope of features and have the sophistication to consistently meet the needs of complex enterprise-scale customers.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230522005161/en/
Strategic Leader position reaffirms Phenom and its Intelligent Talent Experience platform’s consistent ability to serve EMEA’s largest companies’ complex talent demands. (Graphic: Business Wire)
Job vacancy rates recently reached record highs and the competitive talent market remains a priority on the European Union’s policy agenda, according to a European Labour Authority report. To better connect with candidates and quickly fill open roles in a scalable, sustainable way, CHROs and CEOs from today’s leading enterprises are choosing holistic solutions that leverage intelligence, automation and experience to reduce repetitive tasks, increase recruiter efficiency and hyper-personalize every part of the talent journey.
“Artificial intelligence (AI) is accelerating disruption in the TA market,” said David Wilson, CEO, Fosway Group. “Phenom’s position as a Strategic Leader on the 2023 Fosway 9-Grid™ for Talent Acquisition reflects the company’s continued innovation in AI and the candidate and talent experience. Recent acquisitions continue to give the company even greater traction in the European market.”
More than 500 global, diverse enterprises use Phenom’s vast network of data, contextual industry models and deep learning to achieve measurable, defensible results. Case studies of customers using the Intelligent Talent Experience platform document their ability to:
- Generate 11X more internal and external applications and achieved a 50% reduction in time to apply
- Drive a 176% increase in applications and 165% increase in hires YOY
- Deliver 8X more candidates and 20% faster hires
- Save up to 78% of recruiters’ time with automated screening and scheduling
- Decrease time to schedule an interview 98% (from 5 minutes to 5 seconds) with automation
- Increase recruiter productivity 567% and reduce agency spend
- Cut 65 days off time to hire
“Phenom continues to deliver innovation, scale technology and elevate customer support to solve the most complex talent demands of the largest enterprises across Europe,” said Mahe Bayireddi, CEO and co-founder of Phenom. “We are fully invested in the success of our customers’ teams, their outcomes and the incredible impact they’re able to drive for talent acquisition and management — and the business as a whole.”
In addition to their existing talent acquisition technology — including Career Site, CMS, CRM, Video Assessments and AI Scheduling — Phenom recently announced Phenom X+, a new platform-wide generative AI capability that bolsters efficiencies by automating content creation, surfacing actionable intelligence, and eliminating time-consuming tasks. Phenom also unveiled 18 platform intelligence and automation innovations to further transform the way employers teams hire, develop and retain talent.
Platform innovation highlights include:
- Generative AI for TA — providing sourcers, recruiters, talent marketers, and other talent acquisition professionals the ability to generate personalized content that delights candidates and dramatically speeds up the hiring process by eliminating time-consuming, manual work.
- High-Volume Hiring — automating job discovery, application submission, and offering extension processes for frontline and hourly workers.
- Automation Engine — giving organizations the backend interface and control needed to configure and iterate on hiring workflows – complete with intelligence for ongoing monitoring and qualitative analysis of performance, plus recommendations to optimize in real-time.
- Interview Intelligence — eliminating the black box of the interview process by providing transcripts, key takeaways, and actionable guidance to the hiring team to move forward with decisions faster.
- Workforce Intelligence — providing context and oversight to HR teams within their organization, including hiring trends, churn rate, retention risks and high performers, to improve talent onboarding, development and retention.
- Candidate Hub – bringing transparency to candidates throughout the hiring process, making it easy to discover relevant roles, understand hiring status, prepare for interviews, and reschedule when conflicts arise.
Companies across EMEA are successfully adopting Phenom’s Intelligent Talent Experience platform to help candidates find and choose them faster, employees develop their skills and evolve, recruiters become wildly productive, managers build stronger-performing teams, HR align employee development with company goals and HRIS create a holistic tech infrastructure through seamless integrations.
To learn more about Phenom’s Strategic Leader position, read this blog.
To see the Phenom Intelligent Talent Experience platform in action, request a demo.
About the Fosway 9-Grid™
Fosway Group is Europe’s #1 HR industry analyst. The Fosway 9-Grid™ provides a unique assessment of the principal learning and talent supply options available to organizations in EMEA. The analysis is based on extensive independent research and insights from Fosway’s Corporate Research Network of over 250 organizations, including BP, HSBC, PwC, RBS, Sanofi, Shell, and Vodafone. Visit the Fosway website at www.fosway.com.
About Phenom
Phenom has a purpose of helping a billion people find the right job. Through AI-powered talent experiences, employers are using Phenom to hire employees faster, develop them to their full potential, and retain them longer. The Phenom Intelligent Talent Experience platform seamlessly connects candidates, employees, recruiters, hiring managers, HR and HRIS — empowering over 500 diverse and global enterprises with innovative products including Phenom Career Site, Chatbot, CMS, CRM, AI Scheduling, Video Assessments, Campaigns, University Recruiting, Talent Marketplace, Career Pathing, Gigs, Mentoring, and Referrals.
Phenom has earned accolades including: Inc. 5000’s fastest-growing companies (3 consecutive years), Deloitte Technology's Fast 500 (4 consecutive years), five Brandon Hall ‘Excellence in Technology’ awards including Gold for ‘Best Advance in AI for Business Impact,’ Business Intelligence Group's Artificial Intelligence Excellence Awards (3 consecutive years), and a regional Timmy Award for launching and optimizing HelpOneBillion.com (2020).
Headquartered in Greater Philadelphia, Phenom also has offices in India, Israel, the Netherlands, Germany and the United Kingdom.
For more information, please visit www.phenom.com. Connect with Phenom on LinkedIn, Twitter, Facebook, YouTube and Instagram.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230522005161/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
