Business Wire

PA-TRINSEO

19.5.2023 19:24:35 CEST | Business Wire | Press release

Share
Trinseo Starts Up Polycarbonate Dissolution Pilot Facility in the Netherlands

Trinseo (NYSE: TSE), a specialty material solutions provider, announced today the inauguration of its polycarbonate (PC) dissolution pilot facility in Terneuzen, the Netherlands on April 5, 2023. The new pilot facility is a major step in Trinseo’s commitment to sustainability, part of the journey in realizing the company’s sustainability goals. The guests of honor at the inauguration ceremony included Jo-Annes de Bat, Provincial Executive (responsible for regional economy) of the Netherlands.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230515005469/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Trinseo is excited to announce the inauguration of our polycarbonate (PC) dissolution pilot plant in Terneuzen, the Netherlands. This technology allows us to extract 100% recycled PC for use in new materials. (Photo: Business Wire)

An essential element of Trinseo’s innovation is focused on developing and delivering sustainable solutions. Across all businesses, this is a driving force behind our R&D efforts. While we are currently in the R&D phase, the state-of-the-art pilot facility is situated in a temporary area in Trinseo’s Terneuzen site and will later be moved into the Central Process Research Laboratory in the same site, which is currently under construction.

“Dissolution recycling” is a type of physical recycling process where the needed polymer is extracted by the use of solvents. The extracted polymers will then be used to make new recycled polymers. Trinseo’s PC dissolution technology is an advanced technology by which post- or pre-consumer materials containing PC, be it an automotive or consumer electronics part that is mixed with other plastics, metal or even glass, can be put directly into the solvent without any pre-treatment. The solvent will dissolve PC contained in those end-of-life parts while all other non-PC materials will remain, and can then be used for other recycling purposes. The dissolved PC extracted is 100% recycled PC that could be used for compounding into new materials for an array of applications, such as mobile phone casing, printer enclosure or automotive parts.

“We are very excited to have started up the pilot facility for PC dissolution,” said Francesca Reverberi, Senior Vice President & Chief Sustainability Officer at Trinseo, “This technology deepens the potential in circularity.”

“This is a R&D milestone in Trinseo’s sustainability journey,” added Han Hendriks, Senior Vice President, Chief Technology Officer. “With our expanding R&D capabilities and organization, more robust innovations are in the pipeline.”

The pilot plant will play a significant role in helping Trinseo achieve its 2030 Sustainability Goals, while accelerating recycling and increasing the supply of sustainable feedstock.

About Trinseo

Trinseo (NYSE: TSE), a specialty material solutions provider, partners with companies to bring ideas to life in an imaginative, smart and sustainably focused manner by combining its premier expertise, forward-looking innovations and best-in-class materials to unlock value for companies and consumers.

From design to manufacturing, Trinseo taps into decades of experience in diverse material solutions to address customers’ unique challenges in a wide range of industries, including building and construction, consumer goods, medical and mobility.

Trinseo’s approximately 3,400 employees bring endless creativity to reimagining the possibilities with clients all over the world from the company’s locations in North America, Europe and Asia Pacific. Trinseo reported net sales of approximately $5.0 billion in 2022. Discover more by visiting www.trinseo.com and connecting with Trinseo on LinkedIn, Twitter, Facebook and WeChat.

Cautionary Note on Forward-Looking Statements

This press release may contain forward-looking statements including, without limitation, statements concerning plans, objectives, goals, projections, forecasts, strategies, future events or performance, and underlying assumptions and other statements, which are not statements of historical facts or guarantees or assurances of future performance. Forward-looking statements may be identified by the use of words like "expect," "anticipate," “believe,” "intend," "forecast," "outlook," "will," "may," "might," "see," "tend," "assume," "potential," "likely," "target," "plan," "contemplate," "seek," "attempt," "should," "could," "would" or expressions of similar meaning. Forward-looking statements reflect management’s evaluation of information currently available and are based on our current expectations and assumptions regarding our business, the economy and other future conditions. Because forward-looking statements relate to the future, they are subject to inherent uncertainties, risks and changes in circumstances that are difficult to predict. Factors that might cause future results to differ from those expressed by the forward-looking statements include, but are not limited to, our ability to successfully investigate and remediate chemical releases on or from our sites, make related capital expenditures, reimburse third-party cleanup costs or settle potential regulatory penalties or other claims; our ability to successfully execute our business and transformation strategy; increased costs or disruption in the supply of raw materials; increased energy costs; our ability to successfully generate cost savings and increase profitability through asset restructuring initiatives; compliance with laws and regulations impacting our business; conditions in the global economy and capital markets; and those discussed in our Annual Report on Form 10-K, under Part I, Item 1A —"Risk Factors" and elsewhere in our other reports, filings and furnishings made with the U.S. Securities and Exchange Commission from time to time. As a result of these or other factors, our actual results, performance or achievements may differ materially from those contemplated by the forward-looking statements. Therefore, we caution you against relying on any of these forward-looking statements. The forward-looking statements included in this press release are made only as of the date hereof. We undertake no obligation to publicly update or revise any forward-looking statement as a result of new information, future events or otherwise, except as otherwise required by law.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20230515005469/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products atKitakami Plant Fab23.7.2026 12:19:00 CEST | Press release

Companies Showcase Ongoing Buildout of Manufacturing Infrastructure at K2 to Address Growing Demand for NAND Flash Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their

VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications3.7.2026 12:02:00 CEST | Press release

Enhancing image quality and visual perception for moving-camera systems VeriSilicon (688521.SH) today announced its high-performance CPP2000 Camera Post-Processing (CPP) IP, expanding the company’s Image Signal Processing (ISP) solutions with advanced post-processing capabilities. By improving image quality and visual perception in mobile imaging scenarios, CPP2000 enables more reliable vision performance in robotics, drones, and other mobile vision applications. CPP2000 integrates multiple image processing technologies and can further optimize YUV images output from image signal processors. The IP supports image and video processing at up to 8K resolution and offers multiple hardware configuration options to meet diverse requirements in Power, Performance, Area (PPA), and latency across different applications. CPP2000 leverages the combined operation of multiple image processing technologies, including motion-compensated temporal filtering, advanced spatial noise reduction, chroma adj

Messer Acquires Singapore-Based Industrial Gas Platform; Japan Corporate Advisory Institute Advises Sellers3.7.2026 11:11:00 CEST | Press release

Acquisition of WKS Group strengthens Messer’s Southeast Asia presence Messer, the world’s largest privately held specialist for industrial, medical, electronic and specialty gases, has acquired WKS Group, a Singapore-based industrial gas platform with operations across Singapore and southern Malaysia. Transaction terms were not disclosed. Messer reported consolidated sales of approximately EUR 4.5 billion for its 2025 financial year. Founded in Singapore in 1977, WKS Group comprises six companies and employs approximately 195 people across Singapore and southern Malaysia. The acquisition expands Messer’s operating footprint in Southeast Asia and strengthens its access to key industrial clusters across the region. “We are pleased to have completed this transaction with Messer, whose strategic vision makes them an excellent partner for WKS Group,” said Mr. Wong Koh Hoi, shareholder of WKS Group. “We appreciate JCAI’s professionalism and dedication throughout the process, and their expert

Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 01:00:00 CEST | Press release

Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach

Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 01:00:00 CEST | Press release

Production planned at Fab2 of Kitakami Plant Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stac

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye