PA-TRINSEO
19.5.2023 19:24:35 CEST | Business Wire | Press release
Trinseo (NYSE: TSE), a specialty material solutions provider, announced today the inauguration of its polycarbonate (PC) dissolution pilot facility in Terneuzen, the Netherlands on April 5, 2023. The new pilot facility is a major step in Trinseo’s commitment to sustainability, part of the journey in realizing the company’s sustainability goals. The guests of honor at the inauguration ceremony included Jo-Annes de Bat, Provincial Executive (responsible for regional economy) of the Netherlands.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230515005469/en/
Trinseo is excited to announce the inauguration of our polycarbonate (PC) dissolution pilot plant in Terneuzen, the Netherlands. This technology allows us to extract 100% recycled PC for use in new materials. (Photo: Business Wire)
An essential element of Trinseo’s innovation is focused on developing and delivering sustainable solutions. Across all businesses, this is a driving force behind our R&D efforts. While we are currently in the R&D phase, the state-of-the-art pilot facility is situated in a temporary area in Trinseo’s Terneuzen site and will later be moved into the Central Process Research Laboratory in the same site, which is currently under construction.
“Dissolution recycling” is a type of physical recycling process where the needed polymer is extracted by the use of solvents. The extracted polymers will then be used to make new recycled polymers. Trinseo’s PC dissolution technology is an advanced technology by which post- or pre-consumer materials containing PC, be it an automotive or consumer electronics part that is mixed with other plastics, metal or even glass, can be put directly into the solvent without any pre-treatment. The solvent will dissolve PC contained in those end-of-life parts while all other non-PC materials will remain, and can then be used for other recycling purposes. The dissolved PC extracted is 100% recycled PC that could be used for compounding into new materials for an array of applications, such as mobile phone casing, printer enclosure or automotive parts.
“We are very excited to have started up the pilot facility for PC dissolution,” said Francesca Reverberi, Senior Vice President & Chief Sustainability Officer at Trinseo, “This technology deepens the potential in circularity.”
“This is a R&D milestone in Trinseo’s sustainability journey,” added Han Hendriks, Senior Vice President, Chief Technology Officer. “With our expanding R&D capabilities and organization, more robust innovations are in the pipeline.”
The pilot plant will play a significant role in helping Trinseo achieve its 2030 Sustainability Goals, while accelerating recycling and increasing the supply of sustainable feedstock.
About Trinseo
Trinseo (NYSE: TSE), a specialty material solutions provider, partners with companies to bring ideas to life in an imaginative, smart and sustainably focused manner by combining its premier expertise, forward-looking innovations and best-in-class materials to unlock value for companies and consumers.
From design to manufacturing, Trinseo taps into decades of experience in diverse material solutions to address customers’ unique challenges in a wide range of industries, including building and construction, consumer goods, medical and mobility.
Trinseo’s approximately 3,400 employees bring endless creativity to reimagining the possibilities with clients all over the world from the company’s locations in North America, Europe and Asia Pacific. Trinseo reported net sales of approximately $5.0 billion in 2022. Discover more by visiting www.trinseo.com and connecting with Trinseo on LinkedIn, Twitter, Facebook and WeChat.
Cautionary Note on Forward-Looking Statements
This press release may contain forward-looking statements including, without limitation, statements concerning plans, objectives, goals, projections, forecasts, strategies, future events or performance, and underlying assumptions and other statements, which are not statements of historical facts or guarantees or assurances of future performance. Forward-looking statements may be identified by the use of words like "expect," "anticipate," “believe,” "intend," "forecast," "outlook," "will," "may," "might," "see," "tend," "assume," "potential," "likely," "target," "plan," "contemplate," "seek," "attempt," "should," "could," "would" or expressions of similar meaning. Forward-looking statements reflect management’s evaluation of information currently available and are based on our current expectations and assumptions regarding our business, the economy and other future conditions. Because forward-looking statements relate to the future, they are subject to inherent uncertainties, risks and changes in circumstances that are difficult to predict. Factors that might cause future results to differ from those expressed by the forward-looking statements include, but are not limited to, our ability to successfully investigate and remediate chemical releases on or from our sites, make related capital expenditures, reimburse third-party cleanup costs or settle potential regulatory penalties or other claims; our ability to successfully execute our business and transformation strategy; increased costs or disruption in the supply of raw materials; increased energy costs; our ability to successfully generate cost savings and increase profitability through asset restructuring initiatives; compliance with laws and regulations impacting our business; conditions in the global economy and capital markets; and those discussed in our Annual Report on Form 10-K, under Part I, Item 1A —"Risk Factors" and elsewhere in our other reports, filings and furnishings made with the U.S. Securities and Exchange Commission from time to time. As a result of these or other factors, our actual results, performance or achievements may differ materially from those contemplated by the forward-looking statements. Therefore, we caution you against relying on any of these forward-looking statements. The forward-looking statements included in this press release are made only as of the date hereof. We undertake no obligation to publicly update or revise any forward-looking statement as a result of new information, future events or otherwise, except as otherwise required by law.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230515005469/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Xsolla President Chris Hewish Debuts “Durable Advantage” at Gamescom 202626.8.2026 09:00:00 CEST | Press release
Book Draws on Chris Hewish’s Three Decades of Leadership in the Global Games Industry, Grounded in “Renters vs. Owners” Theory and Five-Pillars for Scaling and Succeeding Xsolla, a leading global commerce company, today announced Durable Advantage: Five Pillars of the Modern Game Business, a new book authored by Chris Hewish, President of Xsolla, launching at Gamescom 2026 in Cologne. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260826628682/en/ Graphic: Xsolla Xsolla's integrated strategy brings together global payments, direct-to-consumer commerce, backend infrastructure, and AI-powered development tools into a unified operating model designed to help studios launch, operate, and scale more efficiently. Rather than relying on disconnected commerce, engagement, and backend systems, developers can activate new capabilities through a common platform foundation that reduces complexity, accelerates deployment, and creates a m
David Hagan, Dean and Pegasus Professor at CREOL, The College of Optics and Photonics, Will Serve as Vice President of SPIE26.8.2026 05:00:00 CEST | Press release
Newly elected SPIE board members bring distinct backgrounds to optics and photonics community David Hagan has been elected to serve as the 2027 Vice President of SPIE, the international society for optics and photonics. He will serve as President-Elect in 2028, and as the Society’s President in 2029. The SPIE Board of Directors is influential in the scientific community, establishing policy and strategy and conducting activities of interest to SPIE Members. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260825934622/en/ Top row, from left to right: David Hagan, Jim McNally, Mark Clampin. Bottom row, from left to right: Marla Dowell, Jana Kainerstorfer, Katie Schwertz The 2026 SPIE President, Julie Bentley, professor of optics at the University of Rochester, made the new electees announcement at the Annual General Meeting of the Society on 25 August during SPIE Optics + Photonics. Terms begin on 1 January 2027. In addition to
FORTÉ Acquires Vega Global, APAC's Largest Systems Integrator, Expanding Global Reach26.8.2026 03:00:00 CEST | Press release
With new presence in Asia, FORTÉ serves customers in more than 70 cities worldwide – the largest global footprint in the industry FORTÉ, the leader in communication and collaboration solutions designed for the modern workplace, today announced its acquisition of Vega Global, APAC’s largest systems integrator and a leading provider of workplace technology and audiovisual solutions serving corporate, education, government and other market segments. With this acquisition, FORTÉ adds to its international presence, including established office locations in Hong Kong, Mainland China, India, Japan, Taiwan, Thailand, Singapore, Korea, Vietnam, Australia, Philippines, Malaysia, Macau, New Zealand, Indonesia, and United Arab Emirates. With its headquarters in Minneapolis, Minn., FORTÉ also has operations in the U.S., Ireland, Germany, Sweden, the United Kingdom, and Mexico. “Multinational organizations need strategic partners who can deliver consistent communication and collaboration experiences
Access Advance Launches Exploration Phase for an AV1/AV2 Device and Software Patent Pool, Invites Participation of Potential Licensors26.8.2026 02:00:00 CEST | Press release
Access Advance LLC announced today that in conjunction with the recent release of the AV2 video codec specification, it has launched the exploratory phase for a new patent pool covering devices and software implementing the AV2 video codec, as well as its predecessor AV1. During this exploratory phase, Access Advance will engage with market participants to seek their input, including holding pool formation discussions with potential licensors to gather their feedback on the scope, structure, and terms of a prospective program. All patent owners with a good-faith belief that they own or control AV1 and/or AV2 essential patents are invited to participate in the pool formation discussions. AV1 adoption is being driven largely by members of the Alliance for Open Media (“AOM”). AOM members such as Google, Meta, and Netflix increasingly utilize AV1 to deliver video, and adoption now spans smart TVs, streaming media players, mobile devices, web browsers, and chipsets. AV2, AOM’s successor to
Lattice to Showcase Industrial FPGA Innovations at FPGAWorld Conference 202625.8.2026 22:00:00 CEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its exhibition plan for the upcoming FPGAWorld Conference 2026, taking place on Sept. 8, 2026, in Stockholm, Sweden. As part of the event, Lattice will deliver technical presentations and host a demo showcase focused on how its low power FPGA solutions are advancing Industrial IoT and sensor bridging applications. Who: Lattice Semiconductor What / When (GMT+2): Tuesday, Sept. 8, 2026 Lattice Demo Showcase Presentations (Track: 12:20 – 13:35, Room Brave 05) “Solving Your Power Puzzle: Lattice FPGAs’ Path to Uncompromised Low Power” “Practical Security Fundamentals for FPGA Engineers” Where: AFRY, Frösundaleden 2A, 169 70 Solna, Sweden The FPGAWorld Conference is an international forum for researchers, engineers, teachers, students, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems, FPGA/ASIC-based products, educational and industrial cases,
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
