ESI-GROUP
11.5.2023 18:01:33 CEST | Business Wire | Press release
Regulatory News:
ESI Group (ISIN Code: FR0004110310, Symbol: ESI), a leading simulation and virtual prototyping software provider for industries worldwide, has announced the launch of IC.IDO Weave. This innovative offering enables businesses to review complex product design virtually from a human-centric manufacturing perspective, eliminating the need for prototypes and physical try-out. IC.IDO Weave builds on the full potential of ESI Group's existing IC.IDO offers to create a novel approach in the industrial metaverse.
Designed for cross-functional engineering and manufacturing teams that define, evaluate, and validate product designs and assembly processes in the Automotive, Aerospace, and Heavy Equipment industries, IC.IDO Weave provides a collaborative, XR-based try-out environment that weaves enterprise teams into the digital thread. Through virtual workspaces, teams of diverse backgrounds can ideate, collaborate, and validate their future processes and products early in the development process, in real-time.
IC.IDO Weave's powerful interactivity enables stakeholders to evaluate complex assembly and service plans in virtual manufacturing environments through a digital try-out experience. This approach allows for immersive product integration, as well as, human-centric assembly process evaluations, assembly line reviews, and service process validations, resulting in a higher level of trust, reinforcing valuable decisions made earlier in the development process, and avoiding costly late changes.
“ESI Group is committed to shaping a better future by harnessing the power of technology to push boundaries and drive progress. IC.IDO Weave accelerates decision-making by allowing stakeholders to collaborate closely in extended reality workspaces. We continue to lead the way with product assembly reviews in an industrial metaverse. This latest launch is in line with the added value ESI Group wants to bring to its customers with IC.IDO: ‘ESI. Innovation without compromise’” declares Emmanuel Leroy, EVP, Chief Product & Technology Officer.
This “all-inclusive” new offer provides flexible access to:
- IC.IDO Integrate: enables individual and collaborative virtual mockup environments to validate product concerns such as packaging, integration, and design for assembly or design for service requirements,
- IC.IDO Build & Maintain: allows for visualization and validation of human-centric assembly or service procedures and ergonomics for digital product designs
- IC.IDO CoLab: powers hosting of virtual tryout environments, for leaner enterprise-scaled collaborative virtual workspace for multi-participant human-centric process reviews
About ESI Group
Founded in 1973, ESI Group envisions a world where Industry commits to bold outcomes, addressing high stakes concerns - environmental impact, safety & comfort for consumers and workers, adaptable and sustainable business models. ESI provides reliable and customized solutions anchored on predictive physics modeling and virtual prototyping expertise to allow industries to make the right decisions at the right time, while managing their complexity. Acting principally in automotive & land transportation, aerospace, defense & naval and heavy industry, ESI is present in more than 18 countries, employs 1000 people around the world and reported 2022 sales of €130 million. ESI is headquartered in France and is listed on compartment B of Euronext Paris.
For further information, go to www.esi-group.com.
https://www.esi-group.com/company/who-we-are
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230511005604/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
TreviPay Partners with Dynatos to Add e-Invoicing Capabilities to its B2B Payments Infrastructure15.9.2026 07:00:00 CEST | Press release
The partnership brings e-invoicing technology and compliance expertise into TreviPay’s B2B payments infrastructure as requirements expand across Europe and other markets TreviPay, a global B2B payments infrastructure partner, today announced a partnership with Dynatos to expand e-invoicing capabilities for TreviPay clients operating across Europe and other markets. Through the partnership, Dynatos Routty Cloud proposition will provide embedded e-invoicing technology and compliance support, helping TreviPay clients exchange invoices across different formats, networks and country requirements in Europe and other global markets. E-invoicing requirements continue to expand across Europe and other global markets, adding complexity for businesses managing invoices across more than 60 countries with mandates announced or already in place. At the same time, invoicing has become an increasingly important part of the B2B buyer experience. TreviPay research found 68% of B2B buyers are more likely
Meiji Group to Showcase Japanese-Quality CMO/CDMO Services and a Global Manufacturing Network at CPHI Milan 202615.9.2026 07:00:00 CEST | Press release
Meiji Seika Pharma Co., Ltd. (HQ: Chuo-ku, Tokyo; President and CEO: Toshiaki Nagasato) will debut as the Meiji Group’s Pharmaceutical Segment at CPHI Milan 2026, at Fiera Milano, Milan, Italy, October 6–8, 2026. At the exhibition, the Meiji Group’s Pharmaceuticals Segment will showcase 80 years of expertise in Japanese standard quality control, manufacturing, and supply network from Japan to Europe, India, and Southeast Asia. It will also highlight group-wide contract manufacturing, from development to supply, tailored to customer needs. Through the exhibition, Meiji Seika Pharma aims to raise global awareness of the Meiji Group’s Pharmaceutical Segment, its brands, capabilities, production capacity, and contract manufacturing services, and to forge new global partnerships to expand its CMO/CDMO business. “CPHI Milan 2026” Exhibition Overview Exhibition Name: CPHI Milan 2026 Dates: October 6 (Tue) – 8 (Thu), 2026 Venue: Fiera Milano (Milan, Italy) Exhibition Area: CMO Area Booth Numbe
Signaloid joins Open Chiplet Atlas Alliance andAnnounces Plans to Make Its UxHw ASICs Available via OCA Ecosystem15.9.2026 06:00:00 CEST | Press release
British compute hardware company Signaloid joins Open Chiplet Atlas (OCA) and plans to bring its distribution-extended compute hardware (UxHw) compute acceleration technology to the OCA ecosystem.UxHw technology speeds up compute-intensive stochastic workloads in AI, science and engineering simulations, robotics, and quantitative finance. British compute hardware company Signaloid has joined the Open Chiplet Atlas (OCA) and announced plans to make its UxHw® compute acceleration technology available as chiplets within the OCA ecosystem. The UxHw technology targets AI and simulation workloads that rely on stochastic methods, including quantitative finance, reinforcement learning, engineering simulations, and world models. The announcement follows Signaloid’s recent tapeout of a UxHw ASIC for robotics and physical AI in an ultra-low-power TSMC process. “The Open Chiplet Atlas (OCA) increases innovation in chip design by defining an open architecture for multi-vendor chiplet interoperabili
Rimini Street and Datacom Announce Strategic Partnership to Accelerate AI Adoption and Drive IT Optimisation Across ANZ14.9.2026 22:00:00 CEST | Press release
Collaboration delivers expert third-party support for Oracle and SAP, keeping systems secure, compliant and stable for immediate Agentic AI ERP innovation while freeing up capital for growth and profitability Rimini Street Inc. (Nasdaq: RMNI), the Software Support and Agentic AI ERP Company™ and the leading third-party support provider for Oracle and SAP software, today announced a strategic partnership with Datacom, one of Australasia’s largest homegrown technology services and solutions providers. The reseller agreement will see Datacom offer Rimini Support™ for Oracle and SAP software to its public and private sector customers across Australia and New Zealand. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260914070894/en/ Rimini Street and Datacom Announce Strategic Partnership to Accelerate AI Adoption and Drive IT Optimisation Across ANZ This collaboration brings together Rimini Street's third-party software support, t
Lattice to Showcase Next Gen Automotive Sensing Innovations at AutoSens Europe 202614.9.2026 22:00:00 CEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its exhibition plan for the upcoming AutoSens Europe 2026, taking place on Sept. 22 – 24, 2026, in Barcelona, Spain. As part of the event, Lattice will deliver a technical presentation and host a demo showcase focused on how its low power FPGA solutions are enabling next-generation automotive sensing, ADAS, and in-vehicle networking applications. Who: Lattice Semiconductor What / When (GMT+2): Sept. 22 – 24, 2026 Lattice Demo Showcase at Booth #215 from local dimming, camera monitoring system, sensor security, and more. Presentation (Sept. 23 at 2:30 p.m., Room 5) “Efficient 360° threat detection for parked vehicles – A distributed, event-driven approach” Where: La Farga de L’Hospitalet, Barcelona, Spain AutoSens Europe is the automotive industry's premier conference and exhibition for perception systems, ADAS, and autonomous vehicle technology. Bringing together over 1,000 en
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
