O-RAN-ALLIANCE-E.V.
15.3.2023 23:28:35 CET | Business Wire | Press release
Memorandum of Understanding between O-RAN ALLIANCE and OpenAirInterface Software Alliance (OAI)
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230315005917/en/
In recently signed Memorandum of Understanding, OAI and O-RAN ALLIANCE agreed to co-operate on open Radio Access Network issues, open source software development, and 5G as well as next generation platforms for demonstrating O-RAN technology. Both organizations will encourage sharing of information in areas of mutual interest and may hold joint meetings and workshops.
”I am very pleased to see the excellent cooperation between O-RAN and OAI,” said Alex Jinsung Choi, Chair of the Board of O-RAN ALLIANCE and SVP Group Technology, Deutsche Telekom. “The MoU will strengthen our cooperation in development of open source software for the RAN. It will allow a more focused cooperation between both organizations and will enhance our software development.”
“We are very excited at the signing of this MoU,” said Raymond Knopp, President of the OpenAirInterface Software Alliance. “This has been a long standing goal for the OpenAirInterface Software Alliance. Firstly, the OAI software follows the O-RAN architecture and paves the way for showcasing the next generation cellular wireless technologies. Secondly, the two organizations are very complementary in their value propositions. We look forward to capitalizing on this collaboration in the future.”
Two New Open Testing and Integration Centres (OTIC) Approved in Asia & Pacific
O-RAN ALLIANCE announces that Asia & Pacific OTIC by ritt7layers and Asia & Pacific OTIC in Singapore have joined the community of Open Testing and Integration Centres. With this addition there are now 11 approved OTICs across Europe, the Americas, and Asia.
OTICs are vendor-independent, open, and qualified labs approved by the O-RAN ALLIANCE that issue awards in the O-RAN Certification and Badging Program.
For more information about OTICs and O-RAN ALLIANCE’s testing and integration work please visit our website.
O-RAN Release 3 Implements Features with 58 New or Updated Technical Documents
O-RAN Release 003 includes enhancements to RAN Slicing and SMO features. It also introduces new features:
- Security requirements and countermeasures for RAN Intelligent Controller (RIC) interfaces and apps, O-Cloud and O2 interface
- Security technical reports with threat and risk analysis outputs for application lifecycle management, log management, service management and orchestration, shared O-RU
- RIC-enabled massive MIMO optimization for non-Grid of Beams (GoB) beamforming method
- RAN Analytics Information Exposure (RAIE) use cases and RIC architecture enhancements for extending RAN-aware optimization capabilities to external services and applications
O-RAN Release 003 also includes 10 new specification titles:
- Network Energy Savings Use Cases Technical Report
- Decoupled SMO Architecture Technical Report
- Application Protocols for R1 Services
- O1 Interface Specification for Near-RT RIC
- Near-RT RIC APIs specification
- Requirements and Reference Design Specification for Enterprise Microcell
- Study on Security for Application Lifecycle Management
- Study on Security Log Management
- Study on Security for Service Management and Orchestration (SMO)
- Study on Security for Shared O-RU
For more details about newly released O-RAN specifications please read our web announcement. All O-RAN specifications are available for download at our website.
O-RAN Global PlugFest Spring 2023 Set to Start at Labs Across Asia, Europe, and North America
The first of the two O-RAN Global PlugFests planned for 2023 will be held in:
- South Korea hosted by KT
- Taiwan hosted by Auray Technology
- Europe hosted by Deutsche Telekom, EANTC, EURECOM, Orange, Telefónica and Vodafone
- USA hosted by University of New Hampshire InterOperability Laboratory
More than 55 companies have indicated their plan to participate.
Planned activities include interoperability and E2E testing, validation and demonstration of Radio Intelligent Controller (RIC) use cases, as well as X-haul transport, O-Cloud, QoS, and security testing.
F2F Meetings Boost Progress of O-RAN Technical Groups
With the easing of pandemic restrictions, O-RAN ALLIANCE resumed face-to-face meetings of its technical groups, greatly accelerating progress in specifications development. Latest F2F meetings took place in February 2023 in Prague with more than 430 delegates from 115 companies and institutions around the world. O-RAN plans to hold two more F2F meetings in 2023, one in June and one in October.
About O-RAN ALLIANCE
The O-RAN ALLIANCE is a world-wide community of more than 300 mobile operators, vendors, and research & academic institutions operating in the Radio Access Network (RAN) industry. As the RAN is an essential part of any mobile network, the O-RAN ALLIANCE’s mission is to re-shape the industry towards more intelligent, open, virtualized and fully interoperable mobile networks. The new O-RAN specifications enable a more competitive and vibrant RAN supplier ecosystem with faster innovation to improve user experience. O-RAN based mobile networks at the same time improve the efficiency of RAN deployments as well as operations by mobile operators. To achieve this, the O-RAN ALLIANCE publishes new RAN specifications, releases open software for the RAN, and supports its members in integration and testing of their implementations.
For more information, please visit www.o-ran.org.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230315005917/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 02:30:00 CET | Press release
Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
