MN-DIGI-INTERNATIONAL
14.3.2023 08:01:47 CET | Business Wire | Press release
Digi International®, (NASDAQ: DGII), a leading provider of Internet of Things (IoT) connectivity solutions, today expanded its Digi XBee® 3 Global Cellular family of solutions with the unveiling of Digi XBee® 3 Cellular LTE Cat 1 and Digi XBee® 3 Cellular LTE-M/NB-IoT smart modems for global deployment. These new modules deliver the power and flexibility of the renowned Digi XBee ecosystem — pre-certified for global cellular deployments to accelerate development times and eliminate the costs associated with carrier certification processes.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230314005045/en/
Digi XBee® 3 Cellular LTE Cat 1 and Digi XBee® 3 Cellular LTE-M/NB-IoT smart modems for global deployment unveiled at Embedded World 2023. (Graphic: Business Wire)
The newest additions to the Digi XBee Global Cellular family are dependable, compact solutions with BLE and end-device carrier certifications that can be used worldwide and are equipped with Global Navigation Satellite System (GNSS) positioning. They deliver simplified and future-proof solutions for developers and original equipment manufacturers (OEMs) looking to add reliable cellular IoT connectivity to their devices or IoT gateways. With pre-integrated certifications, the XBee 3 Global family supports LTE Cat 1, LTE-M and NB-IoT networks, with 2G/3G fallback — for applications that require reliable cellular connectivity, anywhere in the world. These solutions support low-power applications such as meters, smart sensors and other fixed assets that send small portions of data.
Digi XBee Global Cellular family smart modems are designed to be provisioned, managed and monitored by Digi Remote Manager® (Digi RM). Additionally, they support MicroPython programming, Bluetooth, GNSS positioning for geolocation and Digi TrustFence® security.
“Our Digi XBee 3 Global Cellular family expands the XBee ecosystem of RF modules, gateways, adapters and software — giving OEMs access to the smallest, pre-certified modems for cellular networks that will save thousands in development time and money,” said Steve Ericson, Vice President and General Manager of Digi’s OEM Solutions division. “Pre-certification, along with the integration of advanced software and security, and a full ecosystem of tools supports rapid time-to-market.”
Digi XBee 3 Global Cellular Cat 1
Designed for applications that require higher throughput, the XBee 3 Cat 1 smart modem gives customers a single SKU for deployment of cellular products anywhere in the world. It includes 2G/3G fallback for use in regions and countries where Cat 1 isn’t available.
Digi XBee 3 Global Cellular LTE-M/NB-IoT
Offering low-power cellular connectivity, Digi XBee 3 LTE-M/NB-IoT modules are designed for applications that require data collection from edge devices — supporting higher data rates, lower latency and cell tower handoff, making it ideal for mobile applications and asset tracking.
Delivering the lowest power consumption and data transfer rates available, NB-IoT is ideal for battery-powered and passive devices, which transmit small amounts of data at intermittent times.
All smart modems within the XBee Cellular family solution include MicroPython programming resources to enable direct custom scripting, 2G/3G fallback to ensure connectivity, GNSS for accurate location services, OTA firmware updates and access to Digi Remote Manager for over-the-air software updates and monitoring. With built-in Digi TrustFence® security, identity and data privacy features, customers can tap into more than 175 controls to protect against new and evolving cyber threats. The Digi XBee Mobile App and Digi XBee Studio® tool suite simplify setup, configuration and testing. Digi XBee Data Plans are also available for a wide variety of cellular connectivity requirements.
Digi XBee 3 Global Cellular Family solutions are available now. For more information, visit: https://www.digi.com/products/embedded-systems/digi-xbee/cellular-modems.
About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit www.digi.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230314005045/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products atKitakami Plant Fab23.7.2026 12:19:00 CEST | Press release
Companies Showcase Ongoing Buildout of Manufacturing Infrastructure at K2 to Address Growing Demand for NAND Flash Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their
VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications3.7.2026 12:02:00 CEST | Press release
Enhancing image quality and visual perception for moving-camera systems VeriSilicon (688521.SH) today announced its high-performance CPP2000 Camera Post-Processing (CPP) IP, expanding the company’s Image Signal Processing (ISP) solutions with advanced post-processing capabilities. By improving image quality and visual perception in mobile imaging scenarios, CPP2000 enables more reliable vision performance in robotics, drones, and other mobile vision applications. CPP2000 integrates multiple image processing technologies and can further optimize YUV images output from image signal processors. The IP supports image and video processing at up to 8K resolution and offers multiple hardware configuration options to meet diverse requirements in Power, Performance, Area (PPA), and latency across different applications. CPP2000 leverages the combined operation of multiple image processing technologies, including motion-compensated temporal filtering, advanced spatial noise reduction, chroma adj
Messer Acquires Singapore-Based Industrial Gas Platform; Japan Corporate Advisory Institute Advises Sellers3.7.2026 11:11:00 CEST | Press release
Acquisition of WKS Group strengthens Messer’s Southeast Asia presence Messer, the world’s largest privately held specialist for industrial, medical, electronic and specialty gases, has acquired WKS Group, a Singapore-based industrial gas platform with operations across Singapore and southern Malaysia. Transaction terms were not disclosed. Messer reported consolidated sales of approximately EUR 4.5 billion for its 2025 financial year. Founded in Singapore in 1977, WKS Group comprises six companies and employs approximately 195 people across Singapore and southern Malaysia. The acquisition expands Messer’s operating footprint in Southeast Asia and strengthens its access to key industrial clusters across the region. “We are pleased to have completed this transaction with Messer, whose strategic vision makes them an excellent partner for WKS Group,” said Mr. Wong Koh Hoi, shareholder of WKS Group. “We appreciate JCAI’s professionalism and dedication throughout the process, and their expert
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 01:00:00 CEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 01:00:00 CEST | Press release
Production planned at Fab2 of Kitakami Plant Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stac
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom