Business Wire

FESCIOF

10.3.2023 00:11:39 CET | Business Wire | Press release

Share
FESCIOF concludes after convening more than 100 international organizations, forging a roadmap for effective collaboration and sustainable solutions

The Future of Education, Science, and Culture International Organizations Forum (FESCIOF) successfully ended its inaugural convening in Riyadh, uniting for the first time the Arab League Educational, Cultural and Scientific Organization (ALECSO), the Islamic World Educational, Scientific and Cultural Organization (ICESCO), and the United Nations Educational, Scientific and Cultural Organization (UNESCO) plus more than 100 international organizations, leveraging the power of collaboration to drive meaningful impact for the future of international organizations in the fields of education, science, and culture.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230309005847/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

(from left to right) H.E. Mohamed Ould Amar, Director General, ALECSO, H.E. Dr. Salim Al Malik, ICESCO and Costanza Farina, Director, Regional Bureau for Education in the Arab States – UNESCO Representative to Lebanon and Syria (Photo: AETOSWire)

After the forum concluded, the organizers announced their commitment to facilitate further collaboration among international organizations in education, science, and culture. They affirmed the importance of FESCIOF as an innovative effort to align efforts and maximize positive impact through collaboration. Saudi Arabia also took the initiative to host the next two editions of FESCIOF, in 2025 and 2027.

FESCIOF, which featured more than 20 panel sessions with more than 65 speakers under the theme of “Together for Impact in the 21st Century,” aimed to foster insightful discourse and facilitate knowledge exchange to develop a shared vision and identify opportunities for collaboration.

Alongside high-level representatives from UNESCO, ALECSO, and ICESCO, the event facilitated cross-organizational dialogue within a broad ecosystem of change-makers, featuring speakers and attendees from international organizations, including the Islamic Development Bank (IsDB) Group and the United Nations Development Programme (UNDP), as well as experts and thought leaders in organizational design and management from prestigious academic institutions and prominent organizations, such as Harvard Business School, London Business School, INSEAD Blue Ocean Strategy Institute, Google, and Visa, among others.

The representatives from the education, culture and science international organizations reflected on the discussions during the Forum and highlighted its successes, recognizing the value that partnerships between civil society and the private sector bring to the world. During the final session “Preparing the Ground for Future Collaboration,” the panelists, H.E. Mohamed Ouled Amar, Director General of ALECSO; H.E. Dr. Salim Al-Malik, Director General of ICESCO; Costanza Farina, Director Regional Bureau in Beirut and Representative of UNESCO to Lebanon and Syria, emphasized the need to continue working together to create a “Together for Impact” roadmap to achieve shared goals and create a better future for all.

“As organizations and those who are organizing, we need to work at the right time and the right place because the challenge is the value of time,” H.E. Al-Malik said. He also praised the objectives of FESCIOF and said that ICESCO will maximize the conference outcomes and “convert them into action.”

Farina highlighted the interdependence of the three sectors of education, culture, and science, stressing, “we cannot advance on education if we do not advance in science and in culture at the same time.”

Finally, H.E. Mohamed Ould Amar, Director General of ALECSO concluded that “the goals from this Forum are crystal clear, we are working together to achieve them.”

FESCIOF aims to establish a collaborative and trusted global platform for international organizations to come together and capitalize on future opportunities. The event fosters open dialogue and partnership among stakeholders to create a roadmap for international organizations to collaborate more effectively, while establishing a sustainable mechanism for partnerships resulting from the forum.

FESCIOF, which took place from 8-9 March, is jointly organized by the ALECSO and the SNC.

*Source: AETOSWire

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20230309005847/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

TreviPay Partners with Dynatos to Add e-Invoicing Capabilities to its B2B Payments Infrastructure15.9.2026 07:00:00 CEST | Press release

The partnership brings e-invoicing technology and compliance expertise into TreviPay’s B2B payments infrastructure as requirements expand across Europe and other markets TreviPay, a global B2B payments infrastructure partner, today announced a partnership with Dynatos to expand e-invoicing capabilities for TreviPay clients operating across Europe and other markets. Through the partnership, Dynatos Routty Cloud proposition will provide embedded e-invoicing technology and compliance support, helping TreviPay clients exchange invoices across different formats, networks and country requirements in Europe and other global markets. E-invoicing requirements continue to expand across Europe and other global markets, adding complexity for businesses managing invoices across more than 60 countries with mandates announced or already in place. At the same time, invoicing has become an increasingly important part of the B2B buyer experience. TreviPay research found 68% of B2B buyers are more likely

Meiji Group to Showcase Japanese-Quality CMO/CDMO Services and a Global Manufacturing Network at CPHI Milan 202615.9.2026 07:00:00 CEST | Press release

Meiji Seika Pharma Co., Ltd. (HQ: Chuo-ku, Tokyo; President and CEO: Toshiaki Nagasato) will debut as the Meiji Group’s Pharmaceutical Segment at CPHI Milan 2026, at Fiera Milano, Milan, Italy, October 6–8, 2026. At the exhibition, the Meiji Group’s Pharmaceuticals Segment will showcase 80 years of expertise in Japanese standard quality control, manufacturing, and supply network from Japan to Europe, India, and Southeast Asia. It will also highlight group-wide contract manufacturing, from development to supply, tailored to customer needs. Through the exhibition, Meiji Seika Pharma aims to raise global awareness of the Meiji Group’s Pharmaceutical Segment, its brands, capabilities, production capacity, and contract manufacturing services, and to forge new global partnerships to expand its CMO/CDMO business. “CPHI Milan 2026” Exhibition Overview Exhibition Name: CPHI Milan 2026 Dates: October 6 (Tue) – 8 (Thu), 2026 Venue: Fiera Milano (Milan, Italy) Exhibition Area: CMO Area Booth Numbe

Signaloid joins Open Chiplet Atlas Alliance andAnnounces Plans to Make Its UxHw ASICs Available via OCA Ecosystem15.9.2026 06:00:00 CEST | Press release

British compute hardware company Signaloid joins Open Chiplet Atlas (OCA) and plans to bring its distribution-extended compute hardware (UxHw) compute acceleration technology to the OCA ecosystem.UxHw technology speeds up compute-intensive stochastic workloads in AI, science and engineering simulations, robotics, and quantitative finance. British compute hardware company Signaloid has joined the Open Chiplet Atlas (OCA) and announced plans to make its UxHw® compute acceleration technology available as chiplets within the OCA ecosystem. The UxHw technology targets AI and simulation workloads that rely on stochastic methods, including quantitative finance, reinforcement learning, engineering simulations, and world models. The announcement follows Signaloid’s recent tapeout of a UxHw ASIC for robotics and physical AI in an ultra-low-power TSMC process. “The Open Chiplet Atlas (OCA) increases innovation in chip design by defining an open architecture for multi-vendor chiplet interoperabili

Rimini Street and Datacom Announce Strategic Partnership to Accelerate AI Adoption and Drive IT Optimisation Across ANZ14.9.2026 22:00:00 CEST | Press release

Collaboration delivers expert third-party support for Oracle and SAP, keeping systems secure, compliant and stable for immediate Agentic AI ERP innovation while freeing up capital for growth and profitability Rimini Street Inc. (Nasdaq: RMNI), the Software Support and Agentic AI ERP Company™ and the leading third-party support provider for Oracle and SAP software, today announced a strategic partnership with Datacom, one of Australasia’s largest homegrown technology services and solutions providers. The reseller agreement will see Datacom offer Rimini Support™ for Oracle and SAP software to its public and private sector customers across Australia and New Zealand. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260914070894/en/ Rimini Street and Datacom Announce Strategic Partnership to Accelerate AI Adoption and Drive IT Optimisation Across ANZ This collaboration brings together Rimini Street's third-party software support, t

Lattice to Showcase Next Gen Automotive Sensing Innovations at AutoSens Europe 202614.9.2026 22:00:00 CEST | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its exhibition plan for the upcoming AutoSens Europe 2026, taking place on Sept. 22 – 24, 2026, in Barcelona, Spain. As part of the event, Lattice will deliver a technical presentation and host a demo showcase focused on how its low power FPGA solutions are enabling next-generation automotive sensing, ADAS, and in-vehicle networking applications. Who: Lattice Semiconductor What / When (GMT+2): Sept. 22 – 24, 2026 Lattice Demo Showcase at Booth #215 from local dimming, camera monitoring system, sensor security, and more. Presentation (Sept. 23 at 2:30 p.m., Room 5) “Efficient 360° threat detection for parked vehicles – A distributed, event-driven approach” Where: La Farga de L’Hospitalet, Barcelona, Spain AutoSens Europe is the automotive industry's premier conference and exhibition for perception systems, ADAS, and autonomous vehicle technology. Bringing together over 1,000 en

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye