NV-QUECTEL-WIRELESS
9.1.2023 07:16:19 CET | Business Wire | Press release
CES – Quectel Wireless Solutions, a global IoT solutions provider, is today demonstrating its smart module capabilities with compute-intensive and edge intelligence applications. Using Quectel’s high performance SG865W-WF smart module, the demonstration showcases how future use cases of industrial applications, digital signage, unattended retail, fleet management and healthcare can be enabled with edge intelligence and machine vision functionality.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230106005278/en/
Quectel continues to drive digital transformation with advanced smart module, edge intelligence and machine vision technologies at CES 2023 (Graphic: Business Wire)
The SG865W-WF is Quectel’s new generation of Android smart module with built-in octa-core high-performance Kryo 585 CPU, Adreno 650 GPU, Adreno 995 DPU, Adreno 665 VPU, Hexagon DSP, and Spectra 480 ISP. The module supports Wi-Fi 6, Bluetooth 5.1 and 2 × 2 Wi-Fi MIMO technology. A rich set of interfaces such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc. allow the module to serve a wide range of IoT applications including a state-of the-art visual inspection system currently deployed in Quectel’s own automated module production line.
Utilizing the Qualcomm QCS8250 system-on-chip, the Quectel SG865W-WF smart module and industrial equipment including a camera, lens and light, the machine vision solution uses edge computing to deliver the real-time analysis needed to identify defective samples including scratches, dirt, and abnormal surface printing on each module, screening out any defective modules during production. By deploying this solution, Quectel has realized industry-leading accuracy and high-speed defect detection - greatly improving the production efficiency and quality of our products.
“We are committed to driving digital transformation across all industry sectors through our broad IoT portfolio, working closely with our technology partner, Qualcomm,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “The visual inspection solution we have implemented in our own factories, is an excellent example of how we are not only creating the ground-breaking smart modules needed for advanced applications, but also using the technology in our own manufacturing to create a best-in-breed, industry leading defect detection system – helping us to greatly improve quality while saving production costs.”
The visual inspection solution is just one of a range of solutions that have used Quectel smart modules to enable high performance, edge computing and machine vision functionality. Customers looking to develop advanced machine vision and edge intelligence based solutions can work closely with Quectel’s experts to create customized solutions.
To learn more, visit the Quectel booth at CES 2023, North Hall, Booth #10862 where we will be demonstrating the Quectel machine vision solution with edge capabilities.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of over 4,000 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules, antennas and IoT connectivity. With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information: www.quectel.com, LinkedIn, Facebook, and Twitter.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230106005278/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Bending Spoons S.p.A. announces closing of initial public offering2.7.2026 20:35:00 CEST | Press release
Bending Spoons S.p.A. (“Bending Spoons”), a leading technology company, today announces the closing of its initial public offering of an aggregate of 57,971,015 of its ordinary shares, at an initial public offering price of $29.00 per share. The offering consisted of 34,398,640 shares sold by Bending Spoons and 23,572,375 shares sold by certain selling shareholders (the “Selling Shareholders”). The gross proceeds from the offering to Bending Spoons, before deducting underwriting discounts and commissions and other offering expenses, was approximately $953,917,285.50. Bending Spoons did not receive any proceeds from the sale of shares by the Selling Shareholders. Bending Spoons’ ordinary shares began trading on the Nasdaq Global Select Market on July 1, 2026 under the ticker symbol “BSP”. Goldman Sachs International, J.P. Morgan, and Allen & Company LLC are acting as joint lead book-running managers for the offering. Wells Fargo Securities, BofA Securities, Jefferies, Evercore ISI, BNP
Strategic Partnership Between Record Asset Management and Admicasa2.7.2026 19:00:00 CEST | Press release
RAM Swiss Holding AG announces a strategic partnership with Admicasa Holding AG (Admicasa). RAM Swiss Holding AG is a subsidiary of LSE-listed Record Financial Group (Record) and part of the Record Asset Management (RAM) group of companies. The partnership is a milestone in the growth of Admicasa and marks an important step in the continued expansion of Record’s private markets platform. Subject to regulatory approval, the agreement, signed on 1st July 2026, provides RAM Swiss Holding AG with a 50% participation in the Admicasa Fondsleitung AG, part of Admicasa, and establishes a long-term partnership to develop investment opportunities in the Swiss and Global real estate market with a plan to expand into other asset classes in the medium term. RAM is the European asset management arm of Record, the LSE-listed specialist investment group managing USD 115 billion of assets on behalf of institutional clients worldwide. Record's client base comprises pension funds, foundations, sovereign
IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange2.7.2026 16:47:00 CEST | Press release
IQM begins trading on Nasdaq Global Select Market under the ticker symbol “IQMX” Company enters next phase of growth as a publicly traded leader in full-stack superconducting quantum computing IQM maintains a strong pro forma cash position of EUR 337 million IQM Quantum Computers (Nasdaq: IQMX) (“IQM”, “IQM Quantum Computers” or the “Company”), a global leader in full-stack superconducting quantum computers, today became a publicly traded company following the completion of its business combination with Real Asset Acquisition Corp. (“RAAQ”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702960460/en/ IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange The company’s American Depositary Shares begin trading today on the Nasdaq Global Select Market under the ticker symbol “IQMX”. The listing marks a major milestone for IQM establishing the company as the first European quan
GigaDevice Launches First GD24CL Series I²C EEPROM, Further Expanding Its Non-Volatile Memory Portfolio2.7.2026 16:00:00 CEST | Press release
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced today the launch of its new GD24CL series I²C EEPROM. The series delivers outstanding performance, comprehensive security protection mechanisms, and excellent reliability that addresses the stringent requirements for stable and long-term storage of critical configuration data. These offered features will benefit applications in industrial, energy, Internet-of-Things (IoT), data centers, and networking. As GigaDevice’s first EEPROM product series, the launch further enhances the company’s non-volatile memory portfolio and provides customers with more dynamic storage solutions. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702394554/en/ GigaDevice Launches First GD24CL Series I²C EEPROM, Further Expanding Its Non-Volatile Memory Portfolio. The GD24CL series is designed with high
Medical University of Graz Enrolls First Patient in DEEPER CHALLENGE Trial Evaluating Spur® Peripheral Retrievable Scaffold System in a Select CLTI Cohort2.7.2026 13:00:00 CEST | Press release
Reflow Medical, Inc. announces that the Medical University of Graz has enrolled the first patient in the DEEPER CHALLENGE clinical trial. This investigator-initiated, single-center, single-arm, prospective study, supported by a grant, investigates early vessel recoil following below-the-knee treatment using the Spur® Peripheral Retrievable Scaffold System in combination with a commercially available drug-coated balloon. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260701995624/en/ The study investigates early vessel recoil following below-the-knee treatment using the Spur® Peripheral Retrievable Scaffold System in combination with a commercially available drug-coated balloon. The study plans to enroll up to 40 patients with chronic limb-threatening ischemia (CLTI) across two distinct cohorts: patients with diabetes and patients with end-stage renal disease receiving hemodialysis for at least six months, with women comprisi
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom