NV-QUECTEL-WIRELESS
4.1.2023 14:01:53 CET | Business Wire | Press release
CES, Quectel Wireless Solutions, a global IoT and automotive solutions provider, today announces its new automotive grade 5G NR modules, the AG59x series. The new modules deliver a wide range of enhancements including multi-gigabit cellular connectivity, C-V2X PC5 direct communications, improved location services, a high-performance multicore application processor as well as strengthened security, making it an ideal solution in supporting the next generation automotive applications.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230104005509/en/
(Graphic: Business Wire)
Based on the AEC-Q100 qualified Qualcomm chipsets, the new range of modules include the AG59xH series, which integrates the Qualcomm SA525M and the AG59xE series featuring the Qualcomm SA522M inside. Similar to Quectel’s other automotive products, the AG59x modules comply with the international IATF 16949:2016 automotive quality management system to address the demanding requirements of automotive devices. Featuring high robustness, the AG59x series delivers strong performance even under high temperature environments.
“We are very excited to bring the highly anticipated 5G NR Release 16 module to global automotive markets. Its significant improvements in latency and ultra-reliability are critical in supporting autonomous driving,” said Manfred Lindacher, Vice President of Global Sales, Automotive International, Quectel Wireless Solutions. “Combined with its many other advantages, our AG59x series will be an excellent choice for a wide range of automotive applications including telematics boxes, telematics control units, C-V2X systems, on-board units, and roadside units.”
Meeting the 3GPP Release 16 specification and supporting both 5G NR standalone (SA) and non-standalone (NSA) modes, the AG59x modules are backward-compatible with existing LTE, WCDMA and GSM networks, allowing them to be connected in areas without current 5G NR deployment. Additionally, its Dual SIM Dual Standby (DSDS) technology can help tackle poor signal coverage when needed.
The AG59x supports 4 x 4 downlink multiple input multiple output (MIMO) technology which greatly improves wireless communication performance and optimizes data speeds. The AG59xH delivers maximum downlink rates of 4.3Gbps and uplink rates of 1Gbps for 5G NR, while the AG59xE provides up to 2.4Gbps peak downlink rate and 550Mbps uplink rate. Their faster data speeds ensure that user emergency data and diagnostic data can be transferred in real time for increased reliability.
Supporting optional C-V2X PC5 direct communications, the AG59x brings superior performance in vehicle-to-vehicle (V2V) and vehicle-to-roadside infrastructure (V2I) communications for improved traffic efficiency and safety. The module integrates a powerful application processor with up to 20KDMIPS computing power available to run C-V2X stack and applications. It also has an integrated ECDSA engine fulfill C-V2X verification capability.
Additionally, the highly integrated AG59x module provides flexible GNSS positioning services including L1+L5 / L1+L2 (optional) dual frequency GNSS, dead reckoning (DR), and PPE + Data Correction Service to achieve quick and precise location positioning services.
Available in LGA packages, the AG59x is pin-to-pin compatible with Quectel’s previous generation 5G NR automotive modules AG55xQ and AG57xQ, which allows global OEM and Tier 1 customers to upgrade their devices easily and seamlessly through a simple drop-in replacement. The AG59x provides a variety of interfaces including PCIe 3.0, USB 2.0 & 3.1, SDIO, I2S, SPI, I2C, UART, PCM, ADC, (U)SIM, 1PPS, GPIOs. It also supports RGMII and SGMII interfaces at the same time which greatly improves the adaptability of in-vehicle Ethernet.
The Quectel AG59x series is complemented by its range of high-performance antennas, already in use in the autonomous car market. Customized antennas are also supplied to fit for various vehicle setup environments. In particular, Quectel’s range of combo antennas, which integrate multiple technologies such as 5G, 4G, and GNSS, offer a highly flexible and reliable antenna solution for automotive applications.
Engineering samples of the AG59x modules will be available in the first half of 2023, with multiple variants targeting global markets.
Find out more about this module series at CES 2023 on booth 10862.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services.
Our growing global team of over 6,000 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules, antennas and IoT connectivity.
With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information: www.quectel.com, LinkedIn, Facebook, and Twitter.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230104005509/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products atKitakami Plant Fab23.7.2026 12:19:00 CEST | Press release
Companies Showcase Ongoing Buildout of Manufacturing Infrastructure at K2 to Address Growing Demand for NAND Flash Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their
VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications3.7.2026 12:02:00 CEST | Press release
Enhancing image quality and visual perception for moving-camera systems VeriSilicon (688521.SH) today announced its high-performance CPP2000 Camera Post-Processing (CPP) IP, expanding the company’s Image Signal Processing (ISP) solutions with advanced post-processing capabilities. By improving image quality and visual perception in mobile imaging scenarios, CPP2000 enables more reliable vision performance in robotics, drones, and other mobile vision applications. CPP2000 integrates multiple image processing technologies and can further optimize YUV images output from image signal processors. The IP supports image and video processing at up to 8K resolution and offers multiple hardware configuration options to meet diverse requirements in Power, Performance, Area (PPA), and latency across different applications. CPP2000 leverages the combined operation of multiple image processing technologies, including motion-compensated temporal filtering, advanced spatial noise reduction, chroma adj
Messer Acquires Singapore-Based Industrial Gas Platform; Japan Corporate Advisory Institute Advises Sellers3.7.2026 11:11:00 CEST | Press release
Acquisition of WKS Group strengthens Messer’s Southeast Asia presence Messer, the world’s largest privately held specialist for industrial, medical, electronic and specialty gases, has acquired WKS Group, a Singapore-based industrial gas platform with operations across Singapore and southern Malaysia. Transaction terms were not disclosed. Messer reported consolidated sales of approximately EUR 4.5 billion for its 2025 financial year. Founded in Singapore in 1977, WKS Group comprises six companies and employs approximately 195 people across Singapore and southern Malaysia. The acquisition expands Messer’s operating footprint in Southeast Asia and strengthens its access to key industrial clusters across the region. “We are pleased to have completed this transaction with Messer, whose strategic vision makes them an excellent partner for WKS Group,” said Mr. Wong Koh Hoi, shareholder of WKS Group. “We appreciate JCAI’s professionalism and dedication throughout the process, and their expert
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 01:00:00 CEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 01:00:00 CEST | Press release
Production planned at Fab2 of Kitakami Plant Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stac
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
