SEOUL-VIOSYS
3.1.2023 18:01:39 CET | Business Wire | Press release
Seoul Viosys (“SVC”) (KOSDAQ: 092190), a global manufacturer of optical semiconductor devices, announces its latest achievement of being the only component manufacturer to win a CES Innovation Award in the video display category at CES 2023, the world's largest consumer electronics show, with its innovative product, ‘WICOP Pixel’. WICOP Pixel is recognized for its topnotch technology to deliver microLED display in the form of one chip without wire and package.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230103005257/en/
[Figure 1] Stack-structure RGB One-Chip WICOP Pixel (Graphic: Business Wire)
‘WICOP Pixel’ is based on WICOP technology, which does not require wire bonding, packaging or lens. It is the world's first RGB one-chip technology that stacks three RGB microLEDs vertically. This stacking structure enables the manufacture of ultra-small chips and reduces the chip manufacturing and mounting processes to one-third, providing irreplaceable competitiveness in the KRW100 trillion display market. The stack-structure WICOP Pixel also reduces the luminous area to one-third, making it possible to boost transparency as high as more than 90%. This makes WICOP Pixel an essential technology for the future metaverse world including AR and VR.
‘WICOP’ technology allows mounting to be performed without a gold wire, which is an essential component in all existing LED manufacturing processes, and Seoul Viosys is the first in the world to develop and mass-produce a product with the technology. It is one of the core second-generation technologies in the LED industry, and neither miniLEDs nor microLEDs can be made without using WICOP technology.
‘WICOP Pixel’ can be called a semiconductor revolution. Lee Chung-hoon, founder of Seoul Semiconductor and Seoul Viosys, invited journalists from across the world to launch a new product at the Grand Ballroom of the InterContinental Hotel in Shanghai, China in September 2015.
About Seoul Viosys
Seoul Viosys is a full-line solution provider for UV LED, VCSEL (Vertical Cavity Surface Emitting Laser), the next-generation light source for 3D sensor and laser, and a single-pixel RGB “WICOP Pixel” for displays. Established in 2002 as a subsidiary of Seoul Semiconductor, it captured No. 1 market share in the UV LED industry (LEDinside, 2018). Seoul Viosys has an extensive UV LED portfolio with all wavelengths range (200nm to 1600nm) including ultraviolet rays (UV), visible rays and infrared rays. It holds more than 4,000 patents related to UV LED technology. Violeds, its flagship UV LED technology, provides a wide range of industries with optimal solutions for strong sterilization and disinfection (UVC), skin regeneration (UVB), water/air purification and effective cultivation for horticulture. In 2018, Seoul Viosys acquired RayCan, a leading optoelectronic specialist, to add the advanced VCSEL technology which supports smartphone facial recognition and autonomous driving, and has started its mass production. In January 2020, it introduced a disruptive “WICOP Pixel” that has the potential to be a game-changer in the display market. To learn more, visit http://www.seoulviosys.com/en/, YouTube, Facebook.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230103005257/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
New Esri Press Book Empowers Users to Unlock the Potential of AI with the Power of Geography4.8.2026 16:35:00 CEST | Press release
Exploring GeoAI: Tools and Workflows Offers Cutting-Edge Geospatial AI Models and Step-By-Step Tutorials Using ArcGIS Esri has released Exploring GeoAI: Tools and Workflows, a practical guide for applying geospatial AI using ArcGIS. Designed for GIS professionals, analysts, and data scientists, the workbook supports real-world spatial analysis through hands-on GeoAI workflows. The book addresses the growing importance of GeoAI by guiding readers through data preparation, model training, evaluation, and deployment. Step-by-step tutorials use real-world datasets to demonstrate deep learning, object detection, lidar classification, transfer learning, and predictive spatial analysis in ArcGIS. Esri has released Exploring GeoAI: Tools and Workflows, a practical guide to applying geospatial artificial intelligence (GeoAI) using ArcGIS. Designed for GIS professionals, analysts, and data scientists, this hands-on workbook provides the knowledge and tools needed to integrate advanced AI workflo
Rehlko Defines What It Takes to Build AI-Ready Power Infrastructure as Data Center Energy Demands Evolve4.8.2026 15:15:00 CEST | Press release
New eBook highlights how increasingly dynamic AI workloads are reshaping critical power requirements and explores strategies for building resilient, scalable energy infrastructure Rehlko, a global industrial energy resilience platform providing custom-engineered, integrated power solutions for mission-critical infrastructure worldwide, today released new insights on the power infrastructure requirements emerging from the rapid growth of large language models and artificial intelligence. In its latest eBook, AI Readiness Starts with Power: Designing for Real-World Load Conditions, Rehlko examines how increasingly dynamic AI workloads are reshaping expectations for data center power systems and highlights key infrastructure considerations for operators seeking to scale AI capacity reliably and efficiently. As the eBook outlines, AI readiness is increasingly defined not by installed capacity, but by how systems perform under highly variable real-world load conditions. The AI Power Challen
HappyRobot Raises $150 Million Series C to Build Enterprise Superintelligence4.8.2026 14:30:00 CEST | Press release
New funding led by Prysm Capital and co-led by Eurazeo will accelerate global growth as HappyRobot expands its engineering, deployment and go-to-market teams HappyRobot, the company putting AI agents to work across complex enterprise operations, today announced it has raised $150 million in Series C funding led by Prysm Capital and co-led by Eurazeo. Existing investors a16z, Base10, Y Combinator are doubling down with participation from strategics like Koch Disruptive Technologies (KDT), Orange, and T.Capital (Deutsche Telekom), Bankinter, Endeavor Catalyst, Kfund and Wave-X. The round values the company at $1.2 billion post-money, bringing total funding to around $200 million and marking a new stage of growth as enterprises deploy AI agents across mission-critical work. HappyRobot works with more than 150+ enterprise customers, including DHL, Kuehne + Nagel, Naturgy, Repsol, and Uber, and has grown 5x since raising its Series B late last year. After first proving its platform in logis
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND4.8.2026 14:30:00 CEST | Press release
10th-generation QLC 3D flash memory represents a major leap forward for AI storage architectures, cloud platforms, and data‑intensive innovations Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804147821/en/ Leveraging the companies’ revolutionary CMOS directly Bonded to Array (CBA) technology2 which fabricates CMOS logic and the memory array on separate wafers before bonding them together with high-precision wafer-to-wafer alignment, the new generation improves read and write bandwidth c
Altasciences Completes Expansion of Research and Development Laboratory in Harleysville, Pennsylvania4.8.2026 14:00:00 CEST | Press release
Altasciences is excited to share it has expanded the R&D laboratory at its drug product formulation and manufacturing services facility in Harleysville, Pennsylvania, adding approximately 768 square feet of new laboratory space. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804164599/en/ From left to right: Nasir Egal (General Manager, CDMO Services); Marie-Hélène Raigneau (Chief Executive Officer); Anuji Abraham (Senior Director, Pharmaceutical Development, CDMO Services); Robert Sabelli (Co-Chief Operating Officer); Cathy Konidas (Chief Administrative Officer) The expansion brings together formulation development and analytical testing within a single laboratory. This integrated setup is designed to accelerate decision-making, streamline workflows, and strengthen collaboration across scientific disciplines. “With this expansion, we are strengthening our focus on early-stage integration, bringing our CDMO capabilities t
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
