Applied Materials

TechnologyTechnologyTechnology Hardware & Equipment
    
      CMP

    


  * New tungsten CMP application targeted for industry's most challenging chip
    designs
  * Proven dual-wafer platform delivers fastest throughput and lowest cost in
    manufacturing
  * Features Applied's unique closed-loop film thickness and uniformity control
    technology

SANTA CLARA, Calif., June 16, 2011 - Applied Materials, Inc. today announced the
extension of its successful Applied Reflexion(®) GT(TM) CMP* system to include
the planarization of tungsten films. This CMP process is critical to fabricating
the transistor contacts and vias in advanced DRAM, NAND and logic devices. With
the Reflexion GT system's proven dual-wafer architecture, customers can achieve
unmatched throughput and more than 40% lower cost-per-wafer than competing
systems. Importantly, Applied Materials is the only tungsten CMP system
manufacturer to provide closed-loop film thickness and uniformity control - a
vital capability to achieve high yields of today's advanced transistor
structures.

"Fabricating advanced chips is becoming increasingly complex, requiring more
tungsten CMP steps and more sophisticated process control. The Reflexion GT
system can help chipmakers meet these challenges with superior on-wafer
performance at a sustainable cost," said Lakshmanan Karuppiah, general manager
of Applied's CMP business unit. "The rapid adoption by customers of our
innovative Reflexion GT system for copper applications has demonstrated the
value of the dual-wafer concept and resulted in significant market share gains,
further extending our leadership position in this critical chipmaking process."

The Applied Reflexion GT platform, launched in late 2009, set new benchmarks in
CMP performance and productivity. The system's unique dual-mode architecture
enables two wafers to be processed simultaneously on each polishing pad to boost
throughput and significantly cut consumable costs. The system's sophisticated,
real-time profile and endpoint control technologies enable superior profile
control and repeatability.

According to market researcher Gartner Dataquest, Applied Materials was the
clear market leader in CMP in 2010. Applied has more than 3,000 CMP systems at
customer sites worldwide, backed up by the industry's largest service and
support network to optimize equipment uptime and factory efficiency.

For more information on the innovative Reflexion GT CMP system, visit
www.appliedmaterials.com/reflexion-gt.

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. At Applied Materials, we turn today's innovations into the industries of
tomorrow. Learn more at www.appliedmaterials.com.

# # #

* CMP = chemical-mechanical planarization

Contact:
Connie Duncan (editorial/media) 408.563.6209
Michael Sullivan (financial community) 408.986.7977

Caption for exterior photo:
"Applied Materials extends its breakthrough dual-wafer CMP technology to the
planarization of tungsten films -- a critical process used for building
transistor contacts and vias in advanced DRAM, NAND and logic chips."

Caption for interior photo:
"Key to the Reflexion GT system for tungsten is its dual mode architecture that
enables two wafers to be processed simultaneously on each platen to deliver
unmatched throughput and 40% lower cost-per-wafer."




Applied Reflexion GT CMP system exterior: 
http://hugin.info/143724/R/1523480/459489.jpg

Applied Reflexion GT CMP system interior: 
http://hugin.info/143724/R/1523480/459490.jpg




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Source: Applied Materials via Thomson Reuters ONE

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