Applied Materials

TechnologyTechnologyTechnology Hardware & Equipment
    
    

    


  * Unique plasma doping solution targeted for 22nm and beyond logic and memory
    chips
  * Replaces ion beam implantation for conformal doping of complex 3D structures
  * Innovative system opens new market for Applied

SANTA CLARA, Calif., March 16, 2011 - Applied Materials, Inc. today unveiled its
new Applied Centura(®) Conforma(TM) system, which features breakthrough
Conformal Plasma Doping (CPD(TM)) technology to enable the fabrication of
advanced 3D structures in next-generation logic and memory chips. The Conforma
system uniquely combines high-dose, low energy doping technology with in-situ
clean capability in a single vacuum chamber to deliver uniform, high throughput
doping on both planar and 3D structures. Also vital to good device performance
is the system's use of a pure, additive-free doping chemistry that preserves the
underlying device structures - a critical feature not found in any other plasma
doping system.

"Our plasma doping technology capitalizes on Applied's expertise in RF
engineering, CVD chamber design and extensive process knowledge," said Sundar
Ramamurthy, vice president and general manager of the Front End Products
business unit at Applied Materials. "Our Conforma technology has already been
embraced by many of our customers. They have systems running in both pilot and
high-volume manufacturing, and we're also working with customers and research
entities on pioneering R&D programs using our proprietary technology."

Doping is a fundamental chipmaking process that modifies the electrical
properties of a material by incorporating impurities into its crystal lattice
structure. The process is traditionally performed by bombarding the wafer with a
beam of dopant ions moving at high speed. However, this straight line
bombardment process cannot provide uniform doping of advanced three-dimensional
structures. More importantly, the fast-moving ions can damage the ultra-thin
semiconductor layers in cutting-edge chips.

Applied's Conforma technology solves these challenges by providing a gentle,
low-energy process that enables uniform, conformal doping over complex 3D chip
structures. The Centura Conforma is the only plasma doping system that can
combine integrated plasma pre-clean and RTP anneal on the same vacuum platform -
to allow integrated process sequences and to assure that the processed wafers
are free of potentially harmful residues.

Some of the advanced devices enabled by the new Conforma system include finFET
logic, vertical gate DRAM and vertical NAND flash memory arrays. For more
technical details on Applied's breakthrough Conforma technology, visit
http://www.becauseinnovationmatters.com.

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. At Applied Materials, we turn today's innovations into the industries of
tomorrow. Learn more at www.appliedmaterials.com.

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Contact:
Betty Newboe (editorial/media) 408.563.0647
Michael Sullivan (financial community) 408.986.7977




Applied Materials unveils plasma doping technology for 3D chips: 
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