Applied Materials

TechnologyTechnologyTechnology Hardware & Equipment
    
      Wafer Inspection

    


  * First darkfield inspection system to use DUV laser scanning for unmatched
    particle sensitivity
  * Detects particle sizes not seen before by darkfield systems - down to 40nm
    on patterned wafers
  * Significant economic benefit with up to 40% lower CoO than any other
    darkfield tool

SANTA CLARA, Calif., March 16, 2011 - Applied Materials, Inc. today announced a
technology breakthrough for inspecting the challenging interconnect layers in
22nm and below memory and logic chips. The new Applied DFinder(TM) inspection
system is the first darkfield tool to employ deep ultraviolet (DUV) laser
technology, providing chip manufacturers with an unprecedented ability to detect
exceptionally small particles on patterned wafers in a production environment
for higher device yield. Because it was designed specifically for interconnect
inspection, the DFinder system achieves a cost of ownership up to 40% lower than
other darkfield systems - a critical benefit in manufacturing since there can be
more than 50 separate inspection steps.

The DFinder system's exclusive DUV laser illumination technology uniquely
enables the detection of all particles of interest at the 22nm node - down to
40nm in size - which is over 30% smaller than other darkfield systems. In
addition, with its proprietary grazing-angle optical path and full polarization
control the system effectively isolates particles from the pattern on production
wafers, enabling it to find yield-limiting particles while producing an order of
magnitude fewer "false alarm" and nuisance defects. The unmatched ability of the
system to distinguish between wafer patterns and significant defects enables
customers to virtually eliminate the time-consuming and expensive practice of
using un-patterned test wafers.

"Applied's extensive knowledge and experience in thin film deposition provides
us with a unique perspective on the inspection technology our customers need for
optimizing yield in their next generation chips - a capability that no other
equipment company can offer," said Ronen Benzion, vice president and general
manager of Applied's Process Diagnostics and Control business unit. "We've built
the DFinder system from the ground-up to specifically address a new generation
of defects. Our foundry and memory customers are very enthusiastic about this
new tool; we have already sold multiple systems and have repeat orders for
volume production."

To learn more about the breakthrough DFinder system, visit
www.becauseinnovationmatters.com.

Virtually every copper-based chip is manufactured on Applied's equipment, which
also includes systems for etch, patterning films, barrier and seed deposition as
well as advanced automation software to optimize factory efficiency and output.
To learn more about Applied's solutions for advanced interconnect fabrication,
visit www.appliedmaterials.com/interconnects.

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. At Applied Materials, we turn today's innovations into the industries of
tomorrow. Learn more at www.appliedmaterials.com.
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Contact:
Betty Newboe (editorial/media) 408.563.0647
Michael Sullivan (financial community) 408.986.7977




Applied Materials Expands the Limits of Darkfield Inspection with new DFinder System: 
http://hugin.info/143724/R/1497216/432970.jpg




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Source: Applied Materials via Thomson Reuters ONE

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