Applied Materials

TechnologyTechnologyTechnology Hardware & Equipment
    
      ElectroplatingCopper InterconnectsElectrochemical Deposition

    


  * Innovative plating technology enables next-generation memory and
    microprocessor chips for more powerful consumer devices
  * Up to 100% higher throughput and lowest operating cost of any system on the
    market
  * Positioned to accelerate Applied's rapidly growing market share in copper
    plating solutions

SANTA CLARA, Calif., March 17, 2011 - Applied Materials, Inc. today announced a
significant innovation for fabricating copper interconnects at the 22nm
technology node and beyond with its innovative Applied Raider(®) GT
electrochemical deposition (ECD) system. Since advanced chips can have more than
ten levels of interconnects, fabricating these intricate structures is one of
the most process-intensive and cost-sensitive portions of chip manufacturing.
The Raider GT system solves this challenge by enabling customers to fill
extremely narrow, high aspect ratio features while delivering up to 100% higher
wafer throughput and the lowest operating cost of any ECD system.

"The new Raider GT system extends Semitool's ECD technology for the next three
chip generations, enabling our customers to create the advanced devices that are
powering the mobile revolution," said Larry Murphy, corporate vice president and
general manager of the Semitool Business Unit at Applied Materials. "This launch
is the culmination of a very successful year following the integration of
Semitool with Applied Materials- a formidable collaboration that has resulted in
growing our market share and providing the industry with world-class products
like the Raider GT."

Key to the innovative Raider GT system is its high-speed, multi-anode control
system that enables void-free filling of narrow, high aspect ratio trenches and
vias during the critical first few seconds of the deposition process.  This
proprietary technology successfully suppresses the terminal effect to enable
uniform deposition across the wafer, allowing customers to select their
preferred combination of acid concentration and additive components to achieve
optimized gap fill in the smallest features. Other ECD systems must use low-acid
chemistry to achieve acceptable deposition uniformity at the expense of optimum
feature fill.

The Raider GT system supports up to six plating chambers - twice as many as
competing systems - while also accommodating programmable edge and back side
metallic removal chambers, and optional anneal or metrology stations. This
unique system architecture offers Applied's customers unrivalled productivity
and process flexibility.

For more technical details about the innovative Raider GT system, visit
www.becauseinnovationmatters.com.

Applied is the leading supplier of systems for manufacturing copper-based chips,
with a comprehensive portfolio of equipment for depositing, etching and
planarizing interconnect layers. To learn more about Applied's solutions for
advanced interconnect fabrication, visit www.appliedmaterials.com/interconnects.

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. At Applied Materials, we turn today's innovations into the industries of
tomorrow. Learn more at www.appliedmaterials.com.

# # #

Contact:
Betty Newboe (editorial/media) 408.563.0647
Michael Sullivan (financial community) 408.986.7977




Applied Raider GT ECD system for advanced copper interconnects: 
http://hugin.info/143724/R/1497559/433273.jpg




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